Semiconductor Wafer Micro-Operation and Inspection Equipment
This platform is designed by Zolix for semiconductor wafer micro-operation and inspection, which consists of: semiconductor wafer holder unit, semiconductor wafer alignment unit, machine vision unit and micro-manipulator unit, and equipped with the main development of stable motion control system and machine vision software.
Features:
Description:
This platform is designed by Zolix for semiconductor wafer microoperation and inspection, which consists of: semiconductor wafer holder unit, semiconductor wafer alignment unit, machine vision unit and micro-manipulator unit, and equipped with the main development of stable motion control system and machine vision software. A large variety of standard and custom options are available to meet specific process requirements like wafer clamping, alignment, transfer, cleaning, inspection and other functions.
Features:
- The system includes a variety of clamping and alignment structure, which can be customized according to the actual needs from customers.
- Secondary development interfaces are available for control system and machine vision software.
- Specific effective operations will be taken to be compatible with different wafer structures, different Mark point graphics.
- Support multi-dimensional micro-step adjustment of semiconductor wafers.
- Multi-station configuration, higher work efficiency
| Indicators | Data |
| Machine vision resolution(um) | 0.1 |
| Microscope magnification | 0.5~4.5 |
| Camera resolution | 2048×1536 |
| Maximum frame rate(fps) | 15 |
| Camera type | monochrome |
| Light source | Monochromatic coaxial light source |
| Mark point recognition repeatability(µm) | 0.1 |
| Mark point recognition alignment accuracy(um) | <0.5 |
| Stage travel range of rough localization in X-axis(mm) | 400 |
| Stage travel range of rough localization in Y-axis(mm) | 200 |
| Repeatability accuracy of rough localization(um) | 1 |
| Resolution of rough localization(µm) | 士1 |
| Stage travel range of fine localization in X-axis(mm) | 10 |
| Stage travel range of fine localization in Y-axis(mm) | 10 |
| Stage travel range of fine localization in Z-axis(mm) | 20 |
| Fine alignment linear motion unidirectional repeatability(um) | ±1 |
| Fine alignment linear motion resolution(µm) | 0.1 |
| Stage travel range of fine alignment in θZ axis(°) | 5 |
| Number of wafer processing station(set) | 2 |
| Number of wafer vacuum adsorption channels | 4 |
